Out of stock
Epoxy Parfilm mold release is recommended for epoxy resins. Its highly effective, micro-thin, film-forming application offers a better release than polyvinyl alcohol or wax. Its micro-thin film maintains the fidelity of the cast piece and affords better surface reproduction and finish. Heat stable to 635F. New generation of solvent free, premium mold releases No time lost waiting for solvent to evaporate.